Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process

ABSTRACT

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. A first patterned electrode is deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the first electrode and a planarized support layer is deposited over the sacrificial layer, which is then bonded to a substrate wafer. The crystalline substrate is removed and a second patterned electrode is deposited over a second surface of the film. The sacrificial layer is etched to release the air reflection cavity. Also, a cavity can instead be etched into the support layer prior to bonding with the substrate wafer. Alternatively, a reflector structure can be deposited on the first electrode, replacing the cavity.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application claims priority to and is a continuation of U.S.patent application Ser. No. 16/433,849, filed Jun. 6, 2019, which claimspriority to and is a continuation of U.S. patent application Ser. No.15/784,919, filed Oct. 16, 2017 (now U.S. Pat. No. 10,355,659 issuedJul. 16, 2019), which claims priority to and is a continuation-in-partof U.S. patent application Ser. No. 15/068,510, filed Mar. 11, 2016 (nowU.S. Pat. No. 10,217,930 issued Feb. 26, 2019). The present applicationincorporates by reference, for all purposes, the following concurrentlyfiled patent applications, all commonly owned: U.S. patent applicationSer. No. 14/298,057, filed Jun. 6, 2014 (now U.S. Patent No. 9,673,384issued Jun. 6, 2017), U.S. patent application Ser. No. 14/298,076, filedJun. 6, 2014 (now U.S. Pat. No. 9,537,465 issued Jan. 3, 2017), U.S.patent application Ser. No. 14/298,100, filed Jun. 6, 2014 (now U.S.Pat. No. 9,571,061 issued Feb. 14, 2017), U.S. patent application Ser.No. 14/341,314, filed Jul. 25, 2014 (now U.S. Pat. No. 9,805,866 issuedOct. 31, 2017), U.S. patent application Ser. No. 14/449,001, filed Jul.31, 2014 (now U.S. Pat. No. 9,716,581 issued Jul. 25, 2017), and U.S.patent application Ser. No. 14/469,503, filed Aug. 26, 2014 (now U.S.Pat. No. 9,917,568 issued Mar. 13, 2018).

BACKGROUND OF THE INVENTION

The present invention relates generally to electronic devices. Moreparticularly, the present invention provides techniques related to amethod of manufacture and a structure for bulk acoustic wave resonatordevices, single crystal bulk acoustic wave resonator devices, singlecrystal filter and resonator devices, and the like. Merely by way ofexample, the invention has been applied to a single crystal resonatordevice for a communication device, mobile device, computing device,among others.

Mobile telecommunication devices have been successfully deployedworld-wide. Over a billion mobile devices, including cell phones andsmartphones, were manufactured in a single year and unit volumecontinues to increase year-over-year. With ramp of 4G/LTE in about 2012,and explosion of mobile data traffic, data rich content is driving thegrowth of the smartphone segment—which is expected to reach 2 B perannum within the next few years. Coexistence of new and legacy standardsand thirst for higher data rate requirements is driving RF complexity insmartphones. Unfortunately, limitations exist with conventional RFtechnology that is problematic, and may lead to drawbacks in the future.

With 4G LTE and 5G growing more popular by the day, wireless datacommunication demands high performance RF filters with frequenciesaround 5 GHz and higher. Bulk acoustic wave resonators (BAWR) usingcrystalline piezoelectric thin films are leading candidates for meetingsuch demands. Current BAWRs using polycrystalline piezoelectric thinfilms are adequate for bulk acoustic wave (BAW) filters operating atfrequencies ranging from 1 to 3 GHz; however, the quality of thepolycrystalline piezoelectric films degrades quickly as the thicknessesdecrease below around 0.5 um, which is required for resonators andfilters operating at frequencies around 5 GHz and above. Singlecrystalline or epitaxial piezoelectric thin films grown on compatiblecrystalline substrates exhibit good crystalline quality and highpiezoelectric performance even down to very thin thicknesses, e.g., 0.4um. Even so, there are challenges to using and transferring singlecrystal piezoelectric thin films in the manufacture of BAWR and BAWfilters.

From the above, it is seen that techniques for improving methods ofmanufacture and structures for acoustic resonator devices are highlydesirable.

BRIEF SUMMARY OF THE INVENTION

According to the present invention, techniques generally related toelectronic devices are provided. More particularly, the presentinvention provides techniques related to a method of manufacture andstructure for bulk acoustic wave resonator devices, single crystalresonator devices, single crystal filter and resonator devices, and thelike. Merely by way of example, the invention has been applied to asingle crystal resonator device for a communication device, mobiledevice, computing device, among others.

In an example, the present invention provides a method and structure fora transfer process using a sacrificial layer for single crystal acousticresonator devices. In this example, a BAWR with an air reflection cavityis formed. A single crystalline or epitaxial piezoelectric thin film isgrown on a crystalline substrate. A first electrode is deposited on thesurface of the piezoelectric film and patterned. A first passivationlayer or etch-protection layer is deposited over the patterned firstelectrode layer. A sacrificial layer is deposited over the passivationlayer and is then etched. A support layer is deposited over thesacrificial layer. The support layer is planarized or polished and thenbonded to a substrate wafer. The crystalline substrate is removed viagrinding and/or etching to expose the second surface of the singlecrystalline piezoelectric film. The piezoelectric film is etched to formVIA's and etch access holes for the sacrificial layer. A secondelectrode is deposited over the second surface of the piezoelectricfilm. A second passivation layer is deposited over the second electrodelayer and patterned. A contact layer for proving and electricalconnection to other circuits is deposited and patterned. The sacrificiallayer can then be etched to make the air reflection cavity at one sideof the BAW resonator.

In an example, the present invention provides a method and structure fora cavity bond transfer process for single crystal acoustic resonatordevices. In this example, a BAW resonator with an air reflection cavityis formed. The process is similar to that previously described, exceptthat the air cavity is etched inside the support layer after depositionof the support layer rather than using a sacrificial layer.

In an example, the present invention provides a method and structure fora solidly mounted transfer process for single crystal acoustic resonatordevices. In this example, a BAW resonator with a reflector structure(e.g., Bragg-type reflector) is formed with single crystalline orepitaxial piezoelectric film. Compared to the previous examples, thereflector structure is deposited and patterned after the patterning ofthe first electrode and the first passivation layer. The support layeris deposited over the reflector structure and is planarized for bonding.The reflector structure can be multilayer with alternating low and highimpedance layers.

In each of the preceding examples, energy confinement structures can beformed on the first electrode, second electrode, or both. In an example,these energy confinement structures are mass loaded areas surroundingthe resonator area. The resonator area is the area where the firstelectrode, the piezoelectric layer, and the second electrode overlap.The larger mass load in the energy confinement structures lowers acut-off frequency of the resonator. The cut-off frequency is the loweror upper limit of the frequency at which the acoustic wave can propagatein a direction parallel to the surface of the piezoelectric film.Therefore, the cut-off frequency is the resonance frequency in which thewave is travelling along the thickness direction and thus is determinedby the total stack structure of the resonator along the verticaldirection. In piezoelectric films (e.g., AlN), acoustic waves with lowerfrequency than the cut-off frequency can propagate in a paralleldirection along the surface of the film, i.e., the acoustic waveexhibits a high-band-cut-off type dispersion characteristic. In thiscase, the mass loaded area surrounding the resonator provides a barrierpreventing the acoustic wave from propagating outside the resonator. Bydoing so, this feature increases the quality factor (Q) of the resonatorand improves the performance of the resonator and, consequently, thefilter.

In addition, the top single crystalline piezoelectric layer can bereplaced by a polycrystalline piezoelectric film. In such films, thelower part that is close to the interface with the substrate has poorcrystalline quality with smaller grain sizes and a wider distribution ofthe piezoelectric polarization orientation than the upper part of thefilm close to the surface. This is due to the polycrystalline growth ofthe piezoelectric film, i.e., the nucleation and initial film haverandom crystalline orientations. Considering AlN as a piezoelectricmaterial, the growth rate along the c-axis or the polarizationorientation is higher than other crystalline orientations that increasethe proportion of the grains with the c-axis perpendicular to the growthsurface as the film grows thicker. In a typical polycrystalline AlN filmwith about a 1 um thickness, the upper part of the film close to thesurface has better crystalline quality and better alignment in terms ofpiezoelectric polarization. By using the thin film transfer processcontemplated in the present invention, it is possible to use the upperportion of the polycrystalline film in high frequency BAW resonatorswith very thin piezoelectric films. This can be done by removing aportion of the piezoelectric layer during or after the growth substrateremoval process.

In an example, the present invention provides a method for fabricating abulk acoustic wave resonator device. This method can include providing apiezoelectric substrate having a substrate surface region. This piezoelectric substrate can have a piezoelectric layer formed overlying aseed substrate. A topside metal electrode can be formed overlying aportion of the substrate surface region. The method can include forminga topside micro-trench within a portion of the piezoelectric layer andforming one or more bond pads overlying one or more portions of thepiezoelectric layer. A topside metal can be formed overlying a portionof the piezoelectric layer. This topside metal can include a topsidemetal plug, or a bottom side metal plug, formed within the topsidemicro-trench and electrically coupled to at least one of the bond pads.

In an example, the method can include thinning the seed substrate toform a thinned seed substrate. A first backside trench can be formedwithin the thinned seed substrate and underlying the topside metalelectrode. A second backside trench can be formed within the thinnedseed substrate and underlying the topside micro-trench. Also, the methodincludes forming a backside metal electrode underlying one or moreportions of the thinned seed substrate, within the first backsidetrench, and underlying the topside metal electrode; and forming abackside metal plug underlying one or more portions of the thinnedsubstrate, within the second backside trench, and underlying the topsidemicro-trench. The backside metal plug can be electrically coupled to thetopside metal plug and the backside metal electrode. The topsidemicro-trench, the topside metal plug, the second backside trench, andthe backside metal plug form a micro-via. In a specific example, bothbackside trenches can be combined in one trench, where the sharedbackside trench can include the backside metal electrode underlying thetopside metal electrode and the backside metal plug underlying thetopside micro-trench.

In an example, the method can include providing a top cap structure,wherein the top cap structure including an interposer substrate with oneor more through-via structures electrically coupled to one or more topbond pads and one or more bottom bond pads. The top cap structure can bebonded to the piezoelectric substrate, while the one or more bottom bondpads can be electrically coupled to the one or more bond pads and thetopside metal. A backside cap structure can be bonded to the thinnedseed substrate such that the backside cap structure is configuredunderlying the first and second backside trenches, and one or moresolder balls formed overlying the one or more top bond pads.

In an alternative example, the method can include providing a top capstructure, wherein the top cap structure including an interposersubstrate with one or more blind via structures electrically coupled toone or more bottom bond pads. The top cap structure can be bonded to thepiezoelectric substrate, while the one or more bottom bond pads areelectrically coupled to the one or more bond pads and the topside metal.The method can include thinning the top cap structure to expose the oneor more blind vias. One or more top bond pads can be formed overlyingand electrically coupled to the one or more blind vias, and one or moresolder balls can be formed overlying the one or more top bond pads.

In an alternative example, the method can include providing a top capstructure, wherein the top cap structure including a substrate with oneor more bottom bond pads. The top cap structure can be bonded to thepiezoelectric substrate, while the one or more bottom bond pads areelectrically coupled to the one or more bond pads and the topside metal.A backside cap structure can be bonded to the thinned seed substratesuch that the backside cap structure is configured underlying the firstand second backside trenches. The method can include forming one or morebackside bond pads within one or more portions of the backside capstructure. These one or more of the backside bond pads can beelectrically coupled to the backside metal plug. One or more solderballs can be formed underlying the one or more backside bond pads.

In an alternative example, the present invention can provide a methodfor fabricating a top cap or bottom cap free structure, wherein thethinned device is assembled into the final package on the die level.Compared to the examples previously described, the top cap or bottom capfree structure may omit the steps of bonding a top cap structure to thepiezoelectric substrate or the steps of bonding a backside cap structureto the thinned substrate.

One or more benefits are achieved over pre-existing techniques using theinvention. In particular, the present device can be manufactured in arelatively simple and cost effective manner while using conventionalmaterials and/or methods according to one of ordinary skill in the art.Using the present method, one can create a reliable single crystal basedacoustic filter or resonator using multiple ways of three-dimensionalstacking through a wafer level process. Such filters or resonators canbe implemented in an RF filter device, an RF filter system, or the like.Depending upon the embodiment, one or more of these benefits may beachieved.

A further understanding of the nature and advantages of the inventionmay be realized by reference to the latter portions of the specificationand attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more fully understand the present invention, reference ismade to the accompanying drawings. Understanding that these drawings arenot to be considered limitations in the scope of the invention, thepresently described embodiments and the presently understood best modeof the invention are described with additional detail through use of theaccompanying drawings in which:

FIG. 1A is a simplified diagram illustrating an acoustic resonatordevice having topside interconnections according to an example of thepresent invention.

FIG. 1B is a simplified diagram illustrating an acoustic resonatordevice having bottom-side interconnections according to an example ofthe present invention.

FIG. 1C is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections accordingto an example of the present invention.

FIG. 1D is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections with ashared backside trench according to an example of the present invention.

FIGS. 2 and 3 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIG. 4A is a simplified diagram illustrating a step for a methodcreating a topside micro-trench according to an example of the presentinvention.

FIGS. 4B and 4C are simplified diagrams illustrating alternative methodsfor conducting the method step of forming a topside micro-trench asdescribed in FIG. 4A.

FIGS. 4D and 4E are simplified diagrams illustrating an alternativemethod for conducting the method step of forming a topside micro-trenchas described in FIG. 4A.

FIGS. 5 to 8 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIG. 9A is a simplified diagram illustrating a method step for formingbackside trenches according to an example of the present invention.

FIGS. 9B and 9C are simplified diagrams illustrating an alternativemethod for conducting the method step of forming backside trenches, asdescribed in FIG. 9A, and simultaneously singulating a seed substrateaccording to an embodiment of the present invention.

FIG. 10 is a simplified diagram illustrating a method step formingbackside metallization and electrical interconnections between top andbottom sides of a resonator according to an example of the presentinvention.

FIGS. 11A and 11B are simplified diagrams illustrating alternative stepsfor a method of manufacture for an acoustic resonator device accordingto an example of the present invention.

FIGS. 12A to 12E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device using a blind viainterposer according to an example of the present invention.

FIG. 13 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention.

FIGS. 14A to 14G are simplified diagrams illustrating method steps for acap wafer process for an acoustic resonator device according to anexample of the present invention.

FIGS. 15A-15E are simplified diagrams illustrating method steps formaking an acoustic resonator device with shared backside trench, whichcan be implemented in both interposer/cap and interposer free versions,according to examples of the present invention.

FIGS. 16A-16C through FIGS. 31A-31C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a transfer process using a sacrificiallayer for single crystal acoustic resonator devices according to anexample of the present invention.

FIGS. 32A-32C through FIGS. 46A-46C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a cavity bond transfer process for singlecrystal acoustic resonator devices according to an example of thepresent invention.

FIGS. 47A-47C though FIGS. 59A-59C are simplified diagrams illustratingvarious cross-sectional views of a single crystal acoustic resonatordevice and of method steps for a solidly mounted transfer process forsingle crystal acoustic resonator devices according to an example of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

According to the present invention, techniques generally related toelectronic devices are provided. More particularly, the presentinvention provides techniques related to a method of manufacture andstructure for bulk acoustic wave resonator devices, single crystalresonator devices, single crystal filter and resonator devices, and thelike. Merely by way of example, the invention has been applied to asingle crystal resonator device for a communication device, mobiledevice, computing device, among others.

FIG. 1A is a simplified diagram illustrating an acoustic resonatordevice 101 having topside interconnections according to an example ofthe present invention. As shown, device 101 includes a thinned seedsubstrate 112 with an overlying single crystal piezoelectric layer 120,which has a micro-via 129. The micro-via 129 can include a topsidemicro-trench 121, a topside metal plug 146, a backside trench 114, and abackside metal plug 147. Although device 101 is depicted with a singlemicro-via 129, device 101 may have multiple micro-vias. A topside metalelectrode 130 is formed overlying the piezoelectric layer 120. A top capstructure is bonded to the piezoelectric layer 120. This top capstructure includes an interposer substrate 119 with one or morethrough-vias 151 that are connected to one or more top bond pads 143,one or more bond pads 144, and topside metal 145 with topside metal plug146. Solder balls 170 are electrically coupled to the one or more topbond pads 143.

The thinned substrate 112 has the first and second backside trenches113, 114. A backside metal electrode 131 is formed underlying a portionof the thinned seed substrate 112, the first backside trench 113, andthe topside metal electrode 130. The backside metal plug 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal 145. This backside metal plug147 is electrically coupled to the topside metal plug 146 and thebackside metal electrode 131. A backside cap structure 161 is bonded tothe thinned seed substrate 112, underlying the first and second backsidetrenches 113, 114. Further details relating to the method of manufactureof this device will be discussed starting from FIG. 2.

FIG. 1B is a simplified diagram illustrating an acoustic resonatordevice 102 having backside interconnections according to an example ofthe present invention. As shown, device 101 includes a thinned seedsubstrate 112 with an overlying piezoelectric layer 120, which has amicro-via 129. The micro-via 129 can include a topside micro-trench 121,a topside metal plug 146, a backside trench 114, and a backside metalplug 147. Although device 102 is depicted with a single micro-via 129,device 102 may have multiple micro-vias. A topside metal electrode 130is formed overlying the piezoelectric layer 120. A top cap structure isbonded to the piezoelectric layer 120. This top cap structure 119includes bond pads which are connected to one or more bond pads 144 andtopside metal 145 on piezoelectric layer 120. The topside metal 145includes a topside metal plug 146.

The thinned substrate 112 has the first and second backside trenches113, 114. A backside metal electrode 131 is formed underlying a portionof the thinned seed substrate 112, the first backside trench 113, andthe topside metal electrode 130. A backside metal plug 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal plug 146. This backside metalplug 147 is electrically coupled to the topside metal plug 146. Abackside cap structure 162 is bonded to the thinned seed substrate 112,underlying the first and second backside trenches. One or more backsidebond pads (171, 172, 173) are formed within one or more portions of thebackside cap structure 162. Solder balls 170 are electrically coupled tothe one or more backside bond pads 171-173. Further details relating tothe method of manufacture of this device will be discussed starting fromFIG. 14A.

FIG. 1C is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections accordingto an example of the present invention. As shown, device 103 includes athinned seed substrate 112 with an overlying single crystalpiezoelectric layer 120, which has a micro-via 129. The micro-via 129can include a topside micro-trench 121, a topside metal plug 146, abackside trench 114, and a backside metal plug 147. Although device 103is depicted with a single micro-via 129, device 103 may have multiplemicro-vias. A topside metal electrode 130 is formed overlying thepiezoelectric layer 120. The thinned substrate 112 has the first andsecond backside trenches 113, 114. A backside metal electrode 131 isformed underlying a portion of the thinned seed substrate 112, the firstbackside trench 113, and the topside metal electrode 130. A backsidemetal plug 147 is formed underlying a portion of the thinned seedsubstrate 112, the second backside trench 114, and the topside metal145. This backside metal plug 147 is electrically coupled to the topsidemetal plug 146 and the backside metal electrode 131. Further detailsrelating to the method of manufacture of this device will be discussedstarting from FIG. 2.

FIG. 1D is a simplified diagram illustrating an acoustic resonatordevice having interposer/cap-free structure interconnections with ashared backside trench according to an example of the present invention.As shown, device 104 includes a thinned seed substrate 112 with anoverlying single crystal piezoelectric layer 120, which has a micro-via129. The micro-via 129 can include a topside micro-trench 121, a topsidemetal plug 146, and a backside metal 147. Although device 104 isdepicted with a single micro-via 129, device 104 may have multiplemicro-vias. A topside metal electrode 130 is formed overlying thepiezoelectric layer 120. The thinned substrate 112 has a first backsidetrench 113. A backside metal electrode 131 is formed underlying aportion of the thinned seed substrate 112, the first backside trench113, and the topside metal electrode 130. A backside metal 147 is formedunderlying a portion of the thinned seed substrate 112, the secondbackside trench 114, and the topside metal 145. This backside metal 147is electrically coupled to the topside metal plug 146 and the backsidemetal electrode 131. Further details relating to the method ofmanufacture of this device will be discussed starting from FIG. 2.

FIGS. 2 and 3 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1A. FIG. 2 can represent a method step of providing a partiallyprocessed piezoelectric substrate. As shown, device 102 includes a seedsubstrate 110 with a piezoelectric layer 120 formed overlying. In aspecific example, the seed substrate can include silicon, siliconcarbide, aluminum oxide, or single crystal aluminum gallium nitridematerials, or the like. The piezoelectric layer 120 can include apiezoelectric single crystal layer or a thin film piezoelectric singlecrystal layer.

FIG. 3 can represent a method step of forming a top side metallizationor top resonator metal electrode 130. In a specific example, the topsidemetal electrode 130 can include a molybdenum, aluminum, ruthenium, ortitanium material, or the like and combinations thereof. This layer canbe deposited and patterned on top of the piezoelectric layer by alift-off process, a wet etching process, a dry etching process, a metalprinting process, a metal laminating process, or the like. The lift-offprocess can include a sequential process of lithographic patterning,metal deposition, and lift-off steps to produce the topside metal layer.The wet/dry etching processes can includes sequential processes of metaldeposition, lithographic patterning, metal deposition, and metal etchingsteps to produce the topside metal layer. Those of ordinary skill in theart will recognize other variations, modifications, and alternatives.

FIG. 4A is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 401 according to an exampleof the present invention. This figure can represent a method step offorming one or more topside micro-trenches 121 within a portion of thepiezoelectric layer 120. This topside micro-trench 121 can serve as themain interconnect junction between the top and bottom sides of theacoustic membrane, which will be developed in later method steps. In anexample, the topside micro-trench 121 is extends all the way through thepiezoelectric layer 120 and stops in the seed substrate 110. Thistopside micro-trench 121 can be formed through a dry etching process, alaser drilling process, or the like. FIGS. 4B and 4C describe theseoptions in more detail.

FIGS. 4B and 4C are simplified diagrams illustrating alternative methodsfor conducting the method step as described in FIG. 4A. As shown, FIG.4B represents a method step of using a laser drill, which can quicklyand accurately form the topside micro-trench 121 in the piezoelectriclayer 120. In an example, the laser drill can be used to form nominal 50um holes, or holes between 10 um and 500 um in diameter, through thepiezoelectric layer 120 and stop in the seed substrate 110 below theinterface between layers 120 and 110. A protective layer 122 can beformed overlying the piezoelectric layer 120 and the topside metalelectrode 130. This protective layer 122 can serve to protect the devicefrom laser debris and to provide a mask for the etching of the topsidemicro-via 121. In a specific example, the laser drill can be an 11 Whigh power diode-pumped UV laser, or the like. This mask 122 can besubsequently removed before proceeding to other steps. The mask may alsobe omitted from the laser drilling process, and air flow can be used toremove laser debris.

FIG. 4C can represent a method step of using a dry etching process toform the topside micro-trench 121 in the piezoelectric layer 120. Asshown, a lithographic masking layer 123 can be forming overlying thepiezoelectric layer 120 and the topside metal electrode 130. The topsidemicro-trench 121 can be formed by exposure to plasma, or the like.

FIGS. 4D and 4E are simplified diagrams illustrating an alternativemethod for conducting the method step as described in FIG. 4A. Thesefigures can represent the method step of manufacturing multiple acousticresonator devices simultaneously. In FIG. 4D, two devices are shown onDie #1 and Die #2, respectively. FIG. 4E shows the process of forming amicro-via 121 on each of these dies while also etching a scribe line 124or dicing line. In an example, the etching of the scribe line 124singulates and relieves stress in the piezoelectric single crystal layer120.

FIGS. 5 to 8 are simplified diagrams illustrating steps for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. FIG. 5 can represent the method step of formingone or more bond pads 140 and forming a topside metal 141 electricallycoupled to at least one of the bond pads 140. The topside metal 141 caninclude a topside metal plug 146 formed within the topside micro-trench121. In a specific example, the topside metal plug 146 fills the topsidemicro-trench 121 to form a topside portion of a micro-via.

In an example, the bond pads 140 and the topside metal 141 can include agold material or other interconnect metal material depending upon theapplication of the device. These metal materials can be formed by alift-off process, a wet etching process, a dry etching process, ascreen-printing process, an electroplating process, a metal printingprocess, or the like. In a specific example, the deposited metalmaterials can also serve as bond pads for a cap structure, which will bedescribed below.

FIG. 6 can represent a method step for preparing the acoustic resonatordevice for bonding, which can be a hermetic bonding. As shown, a top capstructure is positioned above the partially processed acoustic resonatordevice as described in the previous figures. The top cap structure canbe formed using an interposer substrate 119 in two configurations: fullyprocessed interposer version 601 (through glass via) and partiallyprocessed interposer version 602 (blind via version). In the 601version, the interposer substrate 119 includes through-via structures151 that extend through the interposer substrate 119 and areelectrically coupled to bottom bond pads 142 and top bond pads 143. Inthe 602 version, the interposer substrate 119 includes blind viastructures 152 that only extend through a portion of the interposersubstrate 119 from the bottom side. These blind via structures 152 arealso electrically coupled to bottom bond pads 142. In a specificexample, the interposer substrate can include a silicon, glass,smart-glass, or other like material.

FIG. 7 can represent a method step of bonding the top cap structure tothe partially processed acoustic resonator device. As shown, theinterposer substrate 119 is bonded to the piezoelectric layer by thebond pads (140, 142) and the topside metal 141, which are now denoted asbond pad 144 and topside metal 145. This bonding process can be doneusing a compression bond method or the like. FIG. 8 can represent amethod step of thinning the seed substrate 110, which is now denoted asthinned seed substrate 111. This substrate thinning process can includegrinding and etching processes or the like. In a specific example, thisprocess can include a wafer backgrinding process followed by stressremoval, which can involve dry etching, CMP polishing, or annealingprocesses.

FIG. 9A is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 901 according to an exampleof the present invention. FIG. 9A can represent a method step forforming backside trenches 113 and 114 to allow access to thepiezoelectric layer from the backside of the thinned seed substrate 111.In an example, the first backside trench 113 can be formed within thethinned seed substrate 111 and underlying the topside metal electrode130. The second backside trench 114 can be formed within the thinnedseed substrate 111 and underlying the topside micro-trench 121 andtopside metal plug 146. This substrate is now denoted thinned substrate112. In a specific example, these trenches 113 and 114 can be formedusing deep reactive ion etching (DRIE) processes, Bosch processes, orthe like. The size, shape, and number of the trenches may vary with thedesign of the acoustic resonator device. In various examples, the firstbackside trench may be formed with a trench shape similar to a shape ofthe topside metal electrode or a shape of the backside metal electrode.The first backside trench may also be formed with a trench shape that isdifferent from both a shape of the topside metal electrode and thebackside metal electrode.

FIGS. 9B and 9C are simplified diagrams illustrating an alternativemethod for conducting the method step as described in FIG. 9A. LikeFIGS. 4D and 4E, these figures can represent the method step ofmanufacturing multiple acoustic resonator devices simultaneously. InFIG. 9B, two devices with cap structures are shown on Die #1 and Die #2,respectively. FIG. 9C shows the process of forming backside trenches(113, 114) on each of these dies while also etching a scribe line 115 ordicing line. In an example, the etching of the scribe line 115 providesan optional way to singulate the backside wafer 112.

FIG. 10 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device 1000 according to anexample of the present invention. This figure can represent a methodstep of forming a backside metal electrode 131 and a backside metal plug147 within the backside trenches of the thinned seed substrate 112. Inan example, the backside metal electrode 131 can be formed underlyingone or more portions of the thinned substrate 112, within the firstbackside trench 113, and underlying the topside metal electrode 130.This process completes the resonator structure within the acousticresonator device. The backside metal plug 147 can be formed underlyingone or more portions of the thinned substrate 112, within the secondbackside trench 114, and underlying the topside micro-trench 121. Thebackside metal plug 147 can be electrically coupled to the topside metalplug 146 and the backside metal electrode 131. In a specific example,the backside metal electrode 130 can include a molybdenum, aluminum,ruthenium, or titanium material, or the like and combinations thereof.The backside metal plug can include a gold material, low resistivityinterconnect metals, electrode metals, or the like. These layers can bedeposited using the deposition methods described previously.

FIGS. 11A and 11B are simplified diagrams illustrating alternative stepsfor a method of manufacture for an acoustic resonator device accordingto an example of the present invention. These figures show methods ofbonding a backside cap structure underlying the thinned seed substrate112. In FIG. 11A, the backside cap structure is a dry film cap 161,which can include a permanent photo-imageable dry film such as a soldermask, polyimide, or the like. Bonding this cap structure can becost-effective and reliable, but may not produce a hermetic seal. InFIG. 11B, the backside cap structure is a substrate 162, which caninclude a silicon, glass, or other like material. Bonding this substratecan provide a hermetic seal, but may cost more and require additionalprocesses. Depending upon application, either of these backside capstructures can be bonded underlying the first and second backside vias.

FIGS. 12A to 12E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. More specifically, these figures describeadditional steps for processing the blind via interposer “602” versionof the top cap structure. FIG. 12A shows an acoustic resonator device1201 with blind vias 152 in the top cap structure. In FIG. 12B, theinterposer substrate 119 is thinned, which forms a thinned interposersubstrate 118, to expose the blind vias 152. This thinning process canbe a combination of a grinding process and etching process as describedfor the thinning of the seed substrate. In FIG. 12C, a redistributionlayer (RDL) process and metallization process can be applied to createtop cap bond pads 160 that are formed overlying the blind vias 152 andare electrically coupled to the blind vias 152. As shown in FIG. 12D, aball grid array (BGA) process can be applied to form solder balls 170overlying and electrically coupled to the top cap bond pads 160. Thisprocess leaves the acoustic resonator device ready for wire bonding 171,as shown in FIG. 12E.

FIG. 13 is a simplified diagram illustrating a step for a method ofmanufacture for an acoustic resonator device according to an example ofthe present invention. As shown, device 1300 includes two fullyprocessed acoustic resonator devices that are ready to singulation tocreate separate devices. In an example, the die singulation process canbe done using a wafer dicing saw process, a laser cut singulationprocess, or other processes and combinations thereof.

FIGS. 14A to 14G are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1B. The method for this example of an acoustic resonator can go throughsimilar steps as described in FIGS. 1-5. FIG. 14A shows where thismethod differs from that described previously. Here, the top capstructure substrate 119 and only includes one layer of metallizationwith one or more bottom bond pads 142. Compared to FIG. 6, there are novia structures in the top cap structure because the interconnectionswill be formed on the bottom side of the acoustic resonator device.

FIGS. 14B to 14F depict method steps similar to those described in thefirst process flow. FIG. 14B can represent a method step of bonding thetop cap structure to the piezoelectric layer 120 through the bond pads(140, 142) and the topside metal 141, now denoted as bond pads 144 andtopside metal 145 with topside metal plug 146. FIG. 14C can represent amethod step of thinning the seed substrate 110, which forms a thinnedseed substrate 111, similar to that described in FIG. 8. FIG. 14D canrepresent a method step of forming first and second backside trenches,similar to that described in FIG. 9A. FIG. 14E can represent a methodstep of forming a backside metal electrode 131 and a backside metal plug147, similar to that described in FIG. 10. FIG. 14F can represent amethod step of bonding a backside cap structure 162, similar to thatdescribed in FIGS. 11A and 11B.

FIG. 14G shows another step that differs from the previously describedprocess flow. Here, the backside bond pads 171, 172, and 173 are formedwithin the backside cap structure 162. In an example, these backsidebond pads 171-173 can be formed through a masking, etching, and metaldeposition processes similar to those used to form the other metalmaterials. A BGA process can be applied to form solder balls 170 incontact with these backside bond pads 171-173, which prepares theacoustic resonator device 1407 for wire bonding.

FIGS. 15A to 15E are simplified diagrams illustrating steps for a methodof manufacture for an acoustic resonator device according to an exampleof the present invention. This method illustrates the process forfabricating an acoustic resonator device similar to that shown in FIG.1B. The method for this example can go through similar steps asdescribed in FIG. 1-5. FIG. 15A shows where this method differs fromthat described previously. A temporary carrier 218 with a layer oftemporary adhesive 217 is attached to the substrate. In a specificexample, the temporary carrier 218 can include a glass wafer, a siliconwafer, or other wafer and the like.

FIGS. 15B to 15F depict method steps similar to those described in thefirst process flow. FIG. 15B can represent a method step of thinning theseed substrate 110, which forms a thinned substrate 111, similar to thatdescribed in FIG. 8. In a specific example, the thinning of the seedsubstrate 110 can include a back side grinding process followed by astress removal process. The stress removal process can include a dryetch, a Chemical Mechanical Planarization (CMP), and annealingprocesses.

FIG. 15C can represent a method step of forming a shared backside trench113, similar to the techniques described in FIG. 9A. The main differenceis that the shared backside trench is configured underlying both topsidemetal electrode 130, topside micro-trench 121, and topside metal plug146. In an example, the shared backside trench 113 is a backsideresonator cavity that can vary in size, shape (all possible geometricshapes), and side wall profile (tapered convex, tapered concave, orright angle). In a specific example, the forming of the shared backsidetrench 113 can include a litho-etch process, which can include aback-to-front alignment and dry etch of the backside substrate 111. Thepiezoelectric layer 120 can serve as an etch stop layer for the formingof the shared backside trench 113.

FIG. 15D can represent a method step of forming a backside metalelectrode 131 and a backside metal 147, similar to that described inFIG. 10. In an example, the forming of the backside metal electrode 131can include a deposition and patterning of metal materials within theshared backside trench 113. Here, the backside metal 131 serves as anelectrode and the backside plug/connect metal 147 within the micro-via121. The thickness, shape, and type of metal can vary as a function ofthe resonator/filter design. As an example, the backside electrode 131and via plug metal 147 can be different metals. In a specific example,these backside metals 131, 147 can either be deposited and patterned onthe surface of the piezoelectric layer 120 or rerouted to the backsideof the substrate 112. In an example, the backside metal electrode may bepatterned such that it is configured within the boundaries of the sharedbackside trench such that the backside metal electrode does not come incontact with one or more side-walls of the seed substrate created duringthe forming of the shared backside trench.

FIG. 15E can represent a method step of bonding a backside cap structure162, similar to that described in FIGS. 11A and 11B, following ade-bonding of the temporary carrier 218 and cleaning of the topside ofthe device to remove the temporary adhesive 217. Those of ordinary skillin the art will recognize other variations, modifications, andalternatives of the methods steps described previously.

As used herein, the term “substrate” can mean the bulk substrate or caninclude overlying growth structures such as an aluminum, gallium, orternary compound of aluminum and gallium and nitrogen containingepitaxial region, or functional regions, combinations, and the like.

One or more benefits are achieved over pre-existing techniques using theinvention. In particular, the present device can be manufactured in arelatively simple and cost effective manner while using conventionalmaterials and/or methods according to one of ordinary skill in the art.Using the present method, one can create a reliable single crystal basedacoustic resonator using multiple ways of three-dimensional stackingthrough a wafer level process. Such filters or resonators can beimplemented in an RF filter device, an RF filter system, or the like.

Depending upon the embodiment, one or more of these benefits may beachieved. Of course, there can be other variations, modifications, andalternatives.

With 4G LTE and 5G growing more popular by the day, wireless datacommunication demands high performance RF filters with frequenciesaround 5 GHz and higher. Bulk acoustic wave resonators (BAWR), widelyused in such filters operating at frequencies around 3 GHz and lower,are leading candidates for meeting such demands. Current bulk acousticwave resonators use polycrystalline piezoelectric AlN thin films whereeach grain's c-axis is aligned perpendicular to the film's surface toallow high piezoelectric performance whereas the grains' a- or b-axisare randomly distributed. This peculiar grain distribution works wellwhen the piezoelectric film's thickness is around 1 um and above, whichis the perfect thickness for bulk acoustic wave (BAW) filters operatingat frequencies ranging from 1 to 3 GHz. However, the quality of thepolycrystalline piezoelectric films degrades quickly as the thicknessesdecrease below around 0.5 um, which is required for resonators andfilters operating at frequencies around 5 GHz and above.

Single crystalline or epitaxial piezoelectric thin films grown oncompatible crystalline substrates exhibit good crystalline quality andhigh piezoelectric performance even down to very thin thicknesses, e.g.,0.4 um. The present invention provides manufacturing processes andstructures for high quality bulk acoustic wave resonators with singlecrystalline or epitaxial piezoelectric thn films for high frequency BAWfilter applications.

BAWRs require a piezoelectric material, e.g., AlN, in crystalline form,i.e., polycrystalline or single crystalline. The quality of the filmheavy depends on the chemical, crystalline, or topographical quality ofthe layer on which the film is grown. In conventional BAWR processes(including film bulk acoustic resonator (FBAR) or solidly mountedresonator (SMR) geometry), the piezoelectric film is grown on apatterned bottom electrode, which is usually made of molybdenum (Mo),tungsten (W), or ruthenium (Ru). The surface geometry of the patternedbottom electrode significantly influences the crystalline orientationand crystalline quality of the piezoelectric film, requiring complicatedmodification of the structure.

Thus, the present invention uses single crystalline piezoelectric filmsand thin film transfer processes to produce a BAWR with enhancedultimate quality factor and electro-mechanical coupling for RF filters.Such methods and structures facilitate methods of manufacturing andstructures for RF filters using single crystalline or epitaxialpiezoelectric films to meet the growing demands of contemporary datacommunication.

In an example, the present invention provides transfer structures andprocesses for acoustic resonator devices, which provides a flat,high-quality, single-crystal piezoelectric film for superior acousticwave control and high Q in high frequency. As described above,polycrystalline piezoelectric layers limit Q in high frequency. Also,growing epitaxial piezoelectric layers on patterned electrodes affectsthe crystalline orientation of the piezoelectric layer, which limits theability to have tight boundary control of the resulting resonators.Embodiments of the present invention, as further described below, canovercome these limitations and exhibit improved performance andcost-efficiency.

FIGS. 16A-16C through FIGS. 31A-31C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure with asacrificial layer. In these figure series described below, the “A”figures show simplified diagrams illustrating top cross-sectional viewsof single crystal resonator devices according to various embodiments ofthe present invention. The “B” figures show simplified diagramsillustrating lengthwise cross-sectional views of the same devices in the“A” figures. Similarly, the “C” figures show simplified diagramsillustrating widthwise cross-sectional views of the same devices in the“A” figures. In some cases, certain features are omitted to highlightother features and the relationships between such features. Those ofordinary skill in the art will recognize variations, modifications, andalternatives to the examples shown in these figure series.

FIGS. 16A-16C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a piezoelectric film 1620 overlying a growth substrate 1610. Inan example, the growth substrate 1610 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 1620 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 17A-17C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first electrode 1710 overlying the surface region of thepiezoelectric film 1620. In an example, the first electrode 1710 caninclude molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials. In a specific example, the first electrode 1710 can besubjected to a dry etch with a slope. As an example, the slope can beabout 60 degrees.

FIGS. 18A-18C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first passivation layer 1810 overlying the first electrode1710 and the piezoelectric film 1620. In an example, the firstpassivation layer 1810 can include silicon nitride (SiN), silicon oxide(SiOx), or other like materials. In a specific example, the firstpassivation layer 1810 can have a thickness ranging from about 50 nm toabout 100 nm.

FIGS. 19A-19C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a sacrificial layer 1910 overlying a portion of the firstelectrode 1810 and a portion of the piezoelectric film 1620. In anexample, the sacrificial layer 1910 can include polycrystalline silicon(poly-Si), amorphous silicon (a-Si), or other like materials. In aspecific example, this sacrificial layer 1910 can be subjected to a dryetch with a slope and be deposited with a thickness of about 1 um.Further, phosphorous doped SiO₂ (PSG) can be used as the sacrificiallayer with different combinations of support layer (e.g., SiNx).

FIGS. 20A-20C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a support layer 2010 overlying the sacrificial layer 1910, thefirst electrode 1710, and the piezoelectric film 1620. In an example,the support layer 2010 can include silicon dioxide (SiO₂), siliconnitride (SiN), or other like materials. In a specific example, thissupport layer 2010 can be deposited with a thickness of about 2-3 um. Asdescribed above, other support layers (e.g., SiNx) can be used in thecase of a PSG sacrificial layer.

FIGS. 21A-21C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofpolishing the support layer 2010 to form a polished support layer 2011.In an example, the polishing process can include a chemical-mechanicalplanarization process or the like.

FIGS. 22A-22C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate flipping thedevice and physically coupling overlying the support layer 2011overlying a bond substrate 2210. In an example, the bond substrate 2210can include a bonding support layer 2220 (SiO₂ or like material)overlying a substrate having silicon (Si), sapphire (Al₂O₃), silicondioxide (SiO₂), silicon carbide (SiC), or other like materials. In aspecific embodiment, the bonding support layer 2220 of the bondsubstrate 2210 is physically coupled to the polished support layer 2011.Further, the physical coupling process can include a room temperaturebonding process following by a 300 degree Celsius annealing process.

FIGS. 23A-23C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the growth substrate 1610 or otherwise the transfer of thepiezoelectric film 1620. In an example, the removal process can includea grinding process, a blanket etching process, a film transfer process,an ion implantation transfer process, a laser crack transfer process, orthe like and combinations thereof.

FIGS. 24A-24C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming an electrode contact via 2410 within the piezoelectric film 1620(becoming piezoelectric film 1621) overlying the first electrode 1710and forming one or more release holes 2420 within the piezoelectric film1620 and the first passivation layer 1810 overlying the sacrificiallayer 1910. The via forming processes can include various types ofetching processes.

FIGS. 25A-25C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second electrode 2510 overlying the piezoelectric film 1621.In an example, the formation of the second electrode 2510 includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching the second electrode 2510 to form anelectrode cavity 2511 and to remove portion 2511 from the secondelectrode to form a top metal 2520. Further, the top metal 2520 isphysically coupled to the first electrode 1720 through electrode contactvia 2410.

FIGS. 26A-26C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first contact metal 2610 overlying a portion of the secondelectrode 2510 and a portion of the piezoelectric film 1621, and forminga second contact metal 2611 overlying a portion of the top metal 2520and a portion of the piezoelectric film 1621. In an example, the firstand second contact metals can include gold (Au), aluminum (Al), copper(Cu), nickel (Ni), aluminum bronze (AlCu), or related alloys of thesematerials or other like materials.

FIGS. 27A-27C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second passivation layer 2710 overlying the second electrode2510, the top metal 2520, and the piezoelectric film 1621. In anexample, the second passivation layer 2710 can include silicon nitride(SiN), silicon oxide (SiOx), or other like materials. In a specificexample, the second passivation layer 2710 can have a thickness rangingfrom about 50 nm to about 100 nm.

FIGS. 28A-28C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the sacrificial layer 1910 to form an air cavity 2810. In anexample, the removal process can include a poly-Si etch or an a-Si etch,or the like.

FIGS. 29A-29C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the second electrode 2510 and the top metal 2520 toform a processed second electrode 2910 and a processed top metal 2920.This step can follow the formation of second electrode 2510 and topmetal 2520. In an example, the processing of these two componentsincludes depositing molybdenum (Mo), ruthenium (Ru), tungsten (W), orother like materials; and then etching (e.g., dry etch or the like) thismaterial to form the processed second electrode 2910 with an electrodecavity 2912 and the processed top metal 2920. The processed top metal2920 remains separated from the processed second electrode 2910 by theremoval of portion 2911. In a specific example, the processed secondelectrode 2910 is characterized by the addition of an energy confinementstructure configured on the processed second electrode 2910 to increaseQ.

FIGS. 30A-30C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 1710 to form a processed firstelectrode 2310. This step can follow the formation of first electrode1710. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 3010 with an electrode cavity,similar to the processed second electrode 2910. Air cavity 2811 showsthe change in cavity shape due to the processed first electrode 3010. Ina specific example, the processed first electrode 3010 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 3010 to increase Q.

FIGS. 31A-31C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 1710, to form a processed firstelectrode 2310, and the second electrode 2510/top metal 2520 to form aprocessed second electrode 2910/processed top metal 2920. These stepscan follow the formation of each respective electrode, as described forFIGS. 29A-29C and 30A-30C. Those of ordinary skill in the art willrecognize other variations, modifications, and alternatives.

FIGS. 32A-32C through FIGS. 46A-46C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure withoutsacrificial layer. In these figure series described below, the “A”figures show simplified diagrams illustrating top cross-sectional viewsof single crystal resonator devices according to various embodiments ofthe present invention. The “B” figures show simplified diagramsillustrating lengthwise cross-sectional views of the same devices in the“A” figures. Similarly, the “C” figures show simplified diagramsillustrating widthwise cross-sectional views of the same devices in the“A” figures. In some cases, certain features are omitted to highlightother features and the relationships between such features. Those ofordinary skill in the art will recognize variations, modifications, andalternatives to the examples shown in these figure series.

FIGS. 32A-32C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming apiezoelectric film 3220 overlying a growth substrate 3210. In anexample, the growth substrate 3210 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 3220 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 33A-33C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstelectrode 3310 overlying the surface region of the piezoelectric film3220. In an example, the first electrode 3310 can include molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials. In aspecific example, the first electrode 3310 can be subjected to a dryetch with a slope. As an example, the slope can be about 60 degrees.

FIGS. 34A-34C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstpassivation layer 3410 overlying the first electrode 3310 and thepiezoelectric film 3220. In an example, the first passivation layer 3410can include silicon nitride (SiN), silicon oxide (SiOx), or other likematerials. In a specific example, the first passivation layer 3410 canhave a thickness ranging from about 50 nm to about 100 nm.

FIGS. 35A-35C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a supportlayer 3510 overlying the first electrode 3310, and the piezoelectricfilm 3220. In an example, the support layer 3510 can include silicondioxide (SiO₂), silicon nitride (SiN), or other like materials. In aspecific example, this support layer 3510 can be deposited with athickness of about 2-3 um. As described above, other support layers(e.g., SiNx) can be used in the case of a PSG sacrificial layer.

FIGS. 36A-36C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the optional method step of processingthe support layer 3510 (to form support layer 3511) in region 3610. Inan example, the processing can include a partial etch of the supportlayer 3510 to create a flat bond surface. In a specific example, theprocessing can include a cavity region. In other examples, this step canbe replaced with a polishing process such as a chemical-mechanicalplanarization process or the like.

FIGS. 37A-37C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming an air cavity3710 within a portion of the support layer 3511 (to form support layer3512). In an example, the cavity formation can include an etchingprocess that stops at the first passivation layer 3410.

FIGS. 38A-38C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming one or morecavity vent holes 3810 within a portion of the piezoelectric film 3220through the first passivation layer 3410. In an example, the cavity ventholes 3810 connect to the air cavity 3710.

FIGS. 39A-39C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate flipping the device and physicallycoupling overlying the support layer 3512 overlying a bond substrate3910. In an example, the bond substrate 3910 can include a bondingsupport layer 3920 (SiO₂ or like material) overlying a substrate havingsilicon (Si), sapphire (Al₂O₃), silicon dioxide (SiO₂), silicon carbide(SiC), or other like materials. In a specific embodiment, the bondingsupport layer 3920 of the bond substrate 3910 is physically coupled tothe polished support layer 3512. Further, the physical coupling processcan include a room temperature bonding process following by a 300 degreeCelsius annealing process.

FIGS. 40A-40C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of removing the growthsubstrate 3210 or otherwise the transfer of the piezoelectric film 3220.In an example, the removal process can include a grinding process, ablanket etching process, a film transfer process, an ion implantationtransfer process, a laser crack transfer process, or the like andcombinations thereof.

FIGS. 41A-41C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming an electrodecontact via 4110 within the piezoelectric film 3220 overlying the firstelectrode 3310. The via forming processes can include various types ofetching processes.

FIGS. 42A-42C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a secondelectrode 4210 overlying the piezoelectric film 3220. In an example, theformation of the second electrode 4210 includes depositing molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials; and thenetching the second electrode 4210 to form an electrode cavity 4211 andto remove portion 4211 from the second electrode to form a top metal4220. Further, the top metal 4220 is physically coupled to the firstelectrode 3310 through electrode contact via 4110.

FIGS. 43A-43C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to an example of the present invention. Asshown, these figures illustrate the method step of forming a firstcontact metal 4310 overlying a portion of the second electrode 4210 anda portion of the piezoelectric film 3220, and forming a second contactmetal 4311 overlying a portion of the top metal 4220 and a portion ofthe piezoelectric film 3220. In an example, the first and second contactmetals can include gold (Au), aluminum (Al), copper (Cu), nickel (Ni),aluminum bronze (AlCu), or other like materials. This figure also showsthe method step of forming a second passivation layer 4320 overlying thesecond electrode 4210, the top metal 4220, and the piezoelectric film3220. In an example, the second passivation layer 4320 can includesilicon nitride (SiN), silicon oxide (SiOx), or other like materials. Ina specific example, the second passivation layer 4320 can have athickness ranging from about 50 nm to about 100 nm.

FIGS. 44A-44C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process for single crystal acousticresonator devices according to another example of the present invention.As shown, these figures illustrate the method step of processing thesecond electrode 4210 and the top metal 4220 to form a processed secondelectrode 4410 and a processed top metal 4420. This step can follow theformation of second electrode 4210 and top metal 4220. In an example,the processing of these two components includes depositing molybdenum(Mo), ruthenium (Ru), tungsten (W), or other like materials; and thenetching (e.g., dry etch or the like) this material to form the processedsecond electrode 4410 with an electrode cavity 4412 and the processedtop metal 4420. The processed top metal 4420 remains separated from theprocessed second electrode 4410 by the removal of portion 4411. In aspecific example, the processed second electrode 4410 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 4410 to increase Q.

FIGS. 45A-45C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 3310 to form a processed firstelectrode 4510. This step can follow the formation of first electrode3310. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 4510 with an electrode cavity,similar to the processed second electrode 4410. Air cavity 3711 showsthe change in cavity shape due to the processed first electrode 4510. Ina specific example, the processed first electrode 4510 is characterizedby the addition of an energy confinement structure configured on theprocessed second electrode 4510 to increase Q.

FIGS. 46A-46C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process using a sacrificial layer forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 3310, to form a processed firstelectrode 4510, and the second electrode 4210/top metal 4220 to form aprocessed second electrode 4410/processed top metal 4420. These stepscan follow the formation of each respective electrode, as described forFIGS. 44A-44C and 45A-45C. Those of ordinary skill in the art willrecognize other variations, modifications, and alternatives.

FIGS. 47A-47C through FIGS. 59A-59C illustrate a method of fabricationfor an acoustic resonator device using a transfer structure with amultilayer mirror structure. In these figure series described below, the“A” figures show simplified diagrams illustrating top cross-sectionalviews of single crystal resonator devices according to variousembodiments of the present invention. The “B” figures show simplifieddiagrams illustrating lengthwise cross-sectional views of the samedevices in the “A” figures. Similarly, the “C” figures show simplifieddiagrams illustrating widthwise cross-sectional views of the samedevices in the “A” figures. In some cases, certain features are omittedto highlight other features and the relationships between such features.Those of ordinary skill in the art will recognize variations,modifications, and alternatives to the examples shown in these figureseries.

FIGS. 47A-47C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a piezoelectric film 4720 overlying a growth substrate 4710. Inan example, the growth substrate 4710 can include silicon (S), siliconcarbide (SiC), or other like materials. The piezoelectric film 4720 canbe an epitaxial film including aluminum nitride (AlN), gallium nitride(GaN), or other like materials. Additionally, this piezoelectricsubstrate can be subjected to a thickness trim.

FIGS. 48A-48C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first electrode 4810 overlying the surface region of thepiezoelectric film 4720. In an example, the first electrode 4810 caninclude molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials. In a specific example, the first electrode 4810 can besubjected to a dry etch with a slope. As an example, the slope can beabout 60 degrees.

FIGS. 49A-49C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a multilayer mirror or reflector structure. In an example, themultilayer mirror includes at least one pair of layers with a lowimpedance layer 4910 and a high impedance layer 4920. In FIGS. 49A-49C,two pairs of low/high impedance layers are shown (low: 4910 and 4911;high: 4920 and 4921). In an example, the mirror/reflector area can belarger than the resonator area and can encompass the resonator area. Ina specific embodiment, each layer thickness is about ¼ of the wavelengthof an acoustic wave at a targeting frequency. The layers can bedeposited in sequence and be etched afterwards, or each layer can bedeposited and etched individually. In another example, the firstelectrode 4810 can be patterned after the mirror structure is patterned.

FIGS. 50A-50C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a support layer 5010 overlying the mirror structure (layers4910, 4911, 4920, and 4921), the first electrode 4810, and thepiezoelectric film 4720. In an example, the support layer 5010 caninclude silicon dioxide (SiO₂), silicon nitride (SiN), or other likematerials. In a specific example, this support layer 5010 can bedeposited with a thickness of about 2-3 um. As described above, othersupport layers (e.g., SiNx) can be used.

FIGS. 51A-51C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofpolishing the support layer 5010 to form a polished support layer 5011.In an example, the polishing process can include a chemical-mechanicalplanarization process or the like.

FIGS. 52A-52C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate flipping thedevice and physically coupling overlying the support layer 5011overlying a bond substrate 5210. In an example, the bond substrate 5210can include a bonding support layer 5220 (SiO₂ or like material)overlying a substrate having silicon (Si), sapphire (Al₂O₃), silicondioxide (SiO₂), silicon carbide (SiC), or other like materials. In aspecific embodiment, the bonding support layer 5220 of the bondsubstrate 5210 is physically coupled to the polished support layer 5011.Further, the physical coupling process can include a room temperaturebonding process following by a 300 degree Celsius annealing process.

FIGS. 53A-53C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step ofremoving the growth substrate 4710 or otherwise the transfer of thepiezoelectric film 4720. In an example, the removal process can includea grinding process, a blanket etching process, a film transfer process,an ion implantation transfer process, a laser crack transfer process, orthe like and combinations thereof.

FIGS. 54A-54C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming an electrode contact via 5410 within the piezoelectric film 4720overlying the first electrode 4810. The via forming processes caninclude various types of etching processes.

FIGS. 55A-55C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a second electrode 5510 overlying the piezoelectric film 4720.In an example, the formation of the second electrode 5510 includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching the second electrode 5510 to form anelectrode cavity 5511 and to remove portion 5511 from the secondelectrode to form a top metal 5520. Further, the top metal 5520 isphysically coupled to the first electrode 5520 through electrode contactvia 5410.

FIGS. 56A-56C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to an example of thepresent invention. As shown, these figures illustrate the method step offorming a first contact metal 5610 overlying a portion of the secondelectrode 5510 and a portion of the piezoelectric film 4720, and forminga second contact metal 5611 overlying a portion of the top metal 5520and a portion of the piezoelectric film 4720. In an example, the firstand second contact metals can include gold (Au), aluminum (Al), copper(Cu), nickel (Ni), aluminum bronze (AlCu), or other like materials. Thisfigure also shows the method step of forming a second passivation layer5620 overlying the second electrode 5510, the top metal 5520, and thepiezoelectric film 4720. In an example, the second passivation layer5620 can include silicon nitride (SiN), silicon oxide (SiOx), or otherlike materials. In a specific example, the second passivation layer 5620can have a thickness ranging from about 50 nm to about 100 nm.

FIGS. 57A-57C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the second electrode 5510 and the top metal 5520 toform a processed second electrode 5710 and a processed top metal 5720.This step can follow the formation of second electrode 5710 and topmetal 5720. In an example, the processing of these two componentsincludes depositing molybdenum (Mo), ruthenium (Ru), tungsten (W), orother like materials; and then etching (e.g., dry etch or the like) thismaterial to form the processed second electrode 5410 with an electrodecavity 5712 and the processed top metal 5720. The processed top metal5720 remains separated from the processed second electrode 5710 by theremoval of portion 5711. In a specific example, this processing givesthe second electrode and the top metal greater thickness while creatingthe electrode cavity 5712. In a specific example, the processed secondelectrode 5710 is characterized by the addition of an energy confinementstructure configured on the processed second electrode 5710 to increaseQ.

FIGS. 58A-58C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 4810 to form a processed firstelectrode 5810. This step can follow the formation of first electrode4810. In an example, the processing of these two components includesdepositing molybdenum (Mo), ruthenium (Ru), tungsten (W), or other likematerials; and then etching (e.g., dry etch or the like) this materialto form the processed first electrode 5810 with an electrode cavity,similar to the processed second electrode 5710. Compared to the twoprevious examples, there is no air cavity. In a specific example, theprocessed first electrode 5810 is characterized by the addition of anenergy confinement structure configured on the processed secondelectrode 5810 to increase Q.

FIGS. 59A-59C are simplified diagrams illustrating variouscross-sectional views of a single crystal acoustic resonator device andof method steps for a transfer process with a multilayer mirror forsingle crystal acoustic resonator devices according to another exampleof the present invention. As shown, these figures illustrate the methodstep of processing the first electrode 4810, to form a processed firstelectrode 5810, and the second electrode 5510/top metal 5520 to form aprocessed second electrode 5710/processed top metal 5720. These stepscan follow the formation of each respective electrode, as described forFIGS. 57A-57C and 58A-58C. Those of ordinary skill in the art willrecognize other variations, modifications, and alternatives.

In each of the preceding examples relating to transfer processes, energyconfinement structures can be formed on the first electrode, secondelectrode, or both. In an example, these energy confinement structuresare mass loaded areas surrounding the resonator area. The resonator areais the area where the first electrode, the piezoelectric layer, and thesecond electrode overlap. The larger mass load in the energy confinementstructures lowers a cut-off frequency of the resonator. The cut-offfrequency is the lower or upper limit of the frequency at which theacoustic wave can propagate in a direction parallel to the surface ofthe piezoelectric film. Therefore, the cut-off frequency is theresonance frequency in which the wave is travelling along the thicknessdirection and thus is determined by the total stack structure of theresonator along the vertical direction. In piezoelectric films (e.g.,AlN), acoustic waves with lower frequency than the cut-off frequency canpropagate in a parallel direction along the surface of the film, i.e.,the acoustic wave exhibits a high-band-cut-off type dispersioncharacteristic. In this case, the mass loaded area surrounding theresonator provides a barrier preventing the acoustic wave frompropagating outside the resonator. By doing so, this feature increasesthe quality factor of the resonator and improves the performance of theresonator and, consequently, the filter.

In addition, the top single crystalline piezoelectric layer can bereplaced by a polycrystalline piezoelectric film. In such films, thelower part that is close to the interface with the substrate has poorcrystalline quality with smaller grain sizes and a wider distribution ofthe piezoelectric polarization orientation than the upper part of thefilm close to the surface. This is due to the polycrystalline growth ofthe piezoelectric film, i.e., the nucleation and initial film haverandom crystalline orientations. Considering AlN as a piezoelectricmaterial, the growth rate along the c-axis or the polarizationorientation is higher than other crystalline orientations that increasethe proportion of the grains with the c-axis perpendicular to the growthsurface as the film grows thicker. In a typical polycrystalline AlN filmwith about a 1 um thickness, the upper part of the film close to thesurface has better crystalline quality and better alignment in terms ofpiezoelectric polarization. By using the thin film transfer processcontemplated in the present invention, it is possible to use the upperportion of the polycrystalline film in high frequency BAW resonatorswith very thin piezoelectric films. This can be done by removing aportion of the piezoelectric layer during the growth substrate removalprocess. Of course, there can be other variations, modifications, andalternatives.

While the above is a full description of the specific embodiments,various modifications, alternative constructions and equivalents may beused. As an example, the packaged device can include any combination ofelements described above, as well as outside of the presentspecification. Therefore, the above description and illustrations shouldnot be taken as limiting the scope of the present invention which isdefined by the appended claims.

What is claimed is:
 1. An acoustic resonator device comprising: a bond substrate; a bonding support layer overlying the bond substrate; a support layer overlying the bonding support layer, the support layer having an air cavity; a first electrode overlying the air cavity and a portion of the support layer; a first passivation layer overlying the support layer and being physically coupled to the first electrode; a piezoelectric film overlying the support layer, the first electrode, and the air cavity, the piezoelectric film having an electrode contact via; a second electrode formed overlying the piezoelectric film; a top metal formed overlying the piezoelectric film, the top metal being physically coupled to the first electrode through the electrode contact via; a first contact metal formed overlying a portion of the second electrode and the piezoelectric film; a second contact metal formed overlying a portion of the top metal and the piezoelectric film; and a second passivation layer formed overlying the piezoelectric film, the second electrode, and the top metal.
 2. The device of claim 1 wherein the growth substrate and bond substrate include silicon (S), silicon carbide (SiC), sapphire (Al₂O₃), silicon dioxide (SiO₂), or other silicon materials.
 3. The device of claim 1 wherein the piezoelectric film is a single crystal or polycrystalline piezoelectric film that includes aluminum nitride (AlN), gallium nitride (GaN), Al_(x)Ga_(1−x)N alloys, or other epitaxial materials.
 4. The device of claim 1 wherein the piezoelectric film is an upper portion of a polycrystalline piezoelectric film that includes aluminum nitride (AlN), gallium nitride (GaN), Al_(x)Ga_(1−x)N alloys, or other polycrystalline epitaxial materials.
 5. The device of claim 1 wherein the first electrode, second electrode, and top metal include molybdenum (Mo), ruthenium (Ru), tungsten (W), or other conductive materials; and wherein the first and second passivation layers can include silicon nitride (SiN), silicon oxide (SiO), silicon dioxide (SiO₂), or other silicon materials.
 6. The device of claim 1 wherein the first and second contact metals include gold (Au), aluminum (Al), copper (Cu), nickel (Ni), aluminum bronze (AlCu), or other metal materials.
 7. The device of claim 1 wherein the support layer and the bonding support layer include silicon dioxide (SiO₂) or other silicon materials.
 8. The device of claim 1 wherein at least one of the first electrode and the second electrode includes an energy confinement structure.
 9. The device of claim 8 wherein the energy confinement structure is configured as a mass loaded area surrounding a resonator area of the piezoelectric film.
 10. The device of claim 9 wherein the resonator area includes a region where the first electrode, the piezoelectric film, and the second electrode overlap.
 11. An acoustic resonator device comprising: a bond substrate; a bonding support layer overlying the bond substrate; a support layer overlying the bonding support layer; a reflector structure overlying the support layer, wherein the reflector structure includes at least a pair of layers having a low acoustic impedance layer and a high acoustic impedance layer; a first electrode overlying the reflector structure and a portion of the support layer; a piezoelectric film overlying the support layer, the first electrode, and the reflector structure, the piezoelectric film having an electrode contact via; a second electrode formed overlying the piezoelectric film; a top metal formed overlying the piezoelectric film, the top metal being physically coupled to the first electrode through the electrode contact via; a first contact metal formed overlying a portion of the second electrode and the piezoelectric film; a second contact metal formed overlying a portion of the top metal and the piezoelectric film; and a passivation layer formed overlying the piezoelectric film, the second electrode, and the top metal.
 12. The device of claim 11 wherein the growth substrate and bond substrate includes silicon (S), silicon carbide (SiC), sapphire (Al₂O₃), silicon dioxide (SiO₂), or other silicon materials.
 13. The device of claim 11 wherein the piezoelectric film is a single crystal or polycrystalline piezoelectric film that includes aluminum nitride (AlN), gallium nitride (GaN), Al_(x)Ga_(1−x)N alloys, or other epitaxial materials.
 14. The device of claim 11 wherein the piezoelectric film is an upper portion of a polycrystalline piezoelectric film that includes aluminum nitride (AlN), gallium nitride (GaN), Al_(x)Ga_(1−x)N alloys, or other polycrystalline epitaxial materials.
 15. The device of claim 11 wherein the first electrode, second electrode, and top metal include molybdenum (Mo), ruthenium (Ru), tungsten (W), or other conductive materials, wherein the passivation layer can include silicon nitride (SiN), silicon oxide (SiOx), silicon dioxide (SiO₂), or other silicon materials.
 16. The device of claim 11 wherein the first and second contact metals include gold (Au), aluminum (Al), copper (Cu), nickel (Ni), aluminum bronze (AlCu), or other metal materials.
 17. The device of claim 11 wherein the support layer and the bonding support layer include silicon dioxide (SiO₂) or other silicon materials.
 18. The device of claim 11 wherein at least one of the first electrode and the second electrode includes an energy confinement structure.
 19. The device of claim 18 wherein the energy confinement structure is configured as a mass loaded area surrounding a resonator area of the piezoelectric film.
 20. The device of claim 19 wherein the resonator area includes a region where the first electrode, the piezoelectric film, and the second electrode overlap. 